Latest posts
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Semiconductor scaling: IBM and Siemens advance nanostack
IBM and Siemens are working on nanostack, a 3D transistor design. We explain the semiconductor scaling it targets, the EDA bottleneck and what stays unproven.
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Applied Materials and Intel team up
Applied Materials and Intel are collaborating on next-gen chips, including advanced packaging for Foveros 3D stacking. We look at the EPIC Center and the packaging race.
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Capacitive touch controller: what Microchip’s parallel-sensing parts really change
Microchip’s MTCH3380P and MTCH3240P controllers bring parallel sensing to display-free touch interfaces, priced from $0.80. The “first” is self-scoped and the safety claim is “ready,” not certified.
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Advanced packaging: why Applied Materials and Intel are teaming up
Applied Materials and Intel have announced a research collaboration on advanced packaging for AI computing. There is no money and no deadline in the release. The real story is why two of the largest US chip firms are converging on the one step that is holding up AI accelerator supply.
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LG Innotek Vietnam Hub at 10: From Camera Modules to Chip Substrates
LG Innotek’s Hai Phong hub turns 10 — but the story is its pivot from low-margin camera modules into the AI chip substrates the industry can’t make fast enough.
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E&R Engineering Moves Packaging Production From China to Malaysia
E&R Engineering’s new Malaysia plant is small, but it sits inside a real shift: Taiwan’s packaging suppliers are following chipmakers out of China and into Southeast Asia.
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Qualcomm AWS Deal: The $60 Billion Warrant Behind a Vague Press Release
Qualcomm’s release gave no value, products or timeline. Its SEC filing revealed a $60 billion performance-based warrant — and a real bet on AI data-centre silicon and optical interconnect.
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NOR Flash Shortage: Why the AI Supercycle Broke the Web’s Boring Memory
NOR flash — the boot-code memory inside retimers, cars and satellites — is in a structural shortage. Prices rose 100-120% in H1 2026, and no new capacity is planned. Here is what it means for buyers and for India.
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Semiconductor Logistics in India: What the NX Group–ISM MoU Actually Establishes
An information-sharing MoU between NX Group and ISM looks thin on paper, but a dedicated 2027 Dholera logistics centre and Semicon 2.0’s equipment-and-materials pillar make India’s chip-cargo bottleneck the story.
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Cadence RTL Generation Agent: The Claims vs. the Chips
Cadence’s ChipStack agent converts specifications into chip code, with Honda evaluating. We unpack what the 24% and 18% claims actually measure, the twelve-month sprint since acquisition, and the three-way EDA race built on NVIDIA’s stack.