Latest posts
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Applied Materials and Intel team up
Applied Materials and Intel are collaborating on next-gen chips, including advanced packaging for Foveros 3D stacking. We look at the EPIC Center and the packaging race.
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Advanced packaging: why Applied Materials and Intel are teaming up
Applied Materials and Intel have announced a research collaboration on advanced packaging for AI computing. There is no money and no deadline in the release. The real story is why two of the largest US chip firms are converging on the one step that is holding up AI accelerator supply.