Latest posts
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Healthcare cybersecurity: Proofpoint’s care findings
Proofpoint and Ponemon’s healthcare cybersecurity survey finds rising attacks and care disruption. We weigh its self-reported harms against peer-reviewed evidence.
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AI skills gap: Imarticus, IIT Kanpur launch courses
Imarticus Learning and E&ICT Academy, IIT Kanpur have launched a certificate portfolio for undergraduates. We examine the AI skills gap it targets and the credential it confers.
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Hypervisor security: Broadcom’s VMware HyperArmor
Broadcom has launched VMware HyperArmor, adding hypervisor security to VMware Cloud Foundation with virtual patching, allow-listing and SSH MFA. We look at what it does and why it is an add-on.
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Meta enterprise business: Garg to lead APAC
Meta has appointed Ravi Garg to lead its enterprise business across APAC. We look at the hire, the Enterprise Platform it follows, and the messaging franchise behind it.
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X870E motherboard: Colorful’s iGame Vulcan W OC
Colorful’s all-white iGame X870E VULCAN W OC is now in India at ₹66,999 + GST. We look at the specs, a PCIe 5.0 M.2 change, and where it sits against rival X870E boards.
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Aviation MRO software: Ramco’s Frost & Sullivan recognition
Ramco Aviation has received a Frost & Sullivan recognition. We examine the claim behind it, and the heavy-maintenance and compliance pressures reshaping aviation MRO software.
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Data centre power: CHINT’s prefab Power Pod pitch
CHINT is pitching a factory-built Power Pod to speed up data centre power deployment. We separate the engineering story from the company’s savings claims.
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Hospitality robots: YYForce’s Novotel–Mercure rollout
YYForce has signed a partnership to bring service robots across a 772-room Singapore hotel precinct, with humanoid research to follow. We separate the confirmed rollout from the projections.
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AI-led cybersecurity: AAA Technologies pivots
AAA Technologies is repositioning as an AI-led cybersecurity company with four new services and a 100-to-1,000 workforce target. We look at the pivot, the DPDP deadline and the cost data behind it.
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Applied Materials and Intel team up
Applied Materials and Intel are collaborating on next-gen chips, including advanced packaging for Foveros 3D stacking. We look at the EPIC Center and the packaging race.